| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a package for housing an element capable of improving high frequency characteristics, and to provide a packaging structure.SOLUTION: A package 2 for housing an element comprises: a substrate 5 including a packaging region R for an element 3 on a top face; a frame body 6 which is provided on the substrate 5 along an outer periphery of the packaging region R and partially includes a through hole formed parallel to and along the top face of the substrate 5; an input/output terminal 7 provided in the through hole H, extending inside and outside the frame body 6 and including a signal line 71 extended along the inside/outside of the frame body 6 on a top face; a lead terminal 8 provided on the signal line 71 outside of the frame body 6; a wiring board 9 provided in a region surrounded by the frame body 6 on the substrate 5 while being spaced apart from the input/output terminal 7, and including a wiring conductor 91 on a top face; a first bonding wire 10 electrically connecting the signal line 71 and the wiring conductor 91; and a second bonding wire 11 electrically connecting the signal line 71 and the wiring conductor 91 and overlapped with the first bonding wire 10, while being located on the first bonding wire 10 in a planar view.</p> |
