| 摘要 |
PROBLEM TO BE SOLVED: To suppress thermal interference between power chips.SOLUTION: A power semiconductor device 100 includes: a plurality of power chips 20 encapsulated by a package 50 and functioning to control a power; and an IC 10 encapsulated by the package 50 and functioning to control each power chip 20. The IC 10 is arranged at a central part of the package 50 in a plan view, and the plurality of power chips 20 are arranged so as to surround the IC 10 in a plan view. |
