| 摘要 |
<p>The present disclosure relates to a method for manufacturing a substrate frame and a method for manufacturing a semiconductor device comprising same, comprising the steps of: preparing a base and a conductive block comprising two or more conductive pins, each having one end connected to the base and are arranged apart from each other on top of the base; filling an insulation material into a space between the two or more conductive pins and in a space on the periphery of the two or more conductive pins; and forming the substrate frame having an upper surface and a lower surface opposite the upper surface, an insulation portion comprising the insulation material, and two or more conductive portions electrically insulated by the insulation portion, wherein the insulation portion and the two or more conductive portions are connected from the upper surface to the lower surface.</p> |
