| 摘要 |
The disclosure provides an embedded package structure comprising a metal substrate (210a), a chip module (220a), an insulation material layer (230a), and at least one patterned metal layer (240a). The metal substrate (210a) has a first surface (211a) and a second surface (212a). The chip module (220a) is disposed on the first surface of the metal substrate, and comprises at least two stacked chips (222a,221a) being electrically connected to each. The insulation material layer (230a) covers the first surface of the metal substrate and the stacked chips and has an electrical interconnection (231a) formed therein. The patterned metal layer (240a) is positioned on the insulation material layer, and is electrically connected the chip module through the electrical interconnection. The method for manufacturing the embedded package structure is also disclosed. |
