| 发明名称 |
CIRCUIT BOARD FOR MOUNTING ELECTRONIC COMPONENTS |
| 摘要 |
In a circuit board for mounting electronic components, in which electronic components are to be mounted on its two surfaces by a reflow soldering process, the sizes of lands on the primary and secondary surfaces of the circuit board are set different from each other when chips having the same shape are to be mounted on both the primary and secondary surfaces of the circuit board. |
| 申请公布号 |
US2014374152(A1) |
申请公布日期 |
2014.12.25 |
| 申请号 |
US201314364171 |
申请日期 |
2013.01.24 |
| 申请人 |
CANON KABUSHIKI KAISHA |
发明人 |
Hagiwara Yuichi |
| 分类号 |
H05K1/11 |
主分类号 |
H05K1/11 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A circuit board for mounting electronic components, in which electronic components are to be mounted on both a primary surface and a secondary surface thereof by a reflow soldering process, wherein
sizes of lands on the primary surface and the secondary surface of the circuit board, on which chips having a substantially identical shape are to be mounted, are set different from each other. |
| 地址 |
Tokyo JP |
