发明名称 |
HEAT TRANSFER STRUCTURE PLATE, HEAT TRANSFER STRUCTURE PLATE MODULE, AND UNDERSEA DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To check whether a heat conductive resin filling a part of a heat transfer structure plate does not roll in air bubbles.SOLUTION: A heat transfer structure plate 1 is fixed to a printed circuit board on which a heating component is mounted and radiates heat from the heating component. In the heat transfer structure plate 1, a pool part 2 is provided by a part of a surface of the heat transfer structure plate 1 being recessed. The pool part 2 is filled with a heat conductive resin. The heat conductive resin contacts with the heating component to transmit the heat from the heating component to the heat transfer structure plate 1. A resin amount check part 3 is located at a position of the heat transfer structure plate 1 which is visible in a state where the printed circuit board is fixed to the heat transfer structure plate 1. The resin amount check part 3 has multiple depths. A bank part 4 and a passage 5 are located between the pool part 2 and the resin amount check part 3. The bank part 4 prevents the heat conductive resin from flowing from the pool part 2 to the resin amount check part 3. The passage 5 serves as a passage of the heat conductive resin flowing from the pool part 2 into the resin amount check part 3. |
申请公布号 |
JP2014241366(A) |
申请公布日期 |
2014.12.25 |
申请号 |
JP20130123754 |
申请日期 |
2013.06.12 |
申请人 |
FUJITSU LTD |
发明人 |
YOSHIZUMI TAKAHISA;HOSHIYAMA NAOTO |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|