发明名称 面実装が可能な導電性ポリマー電子デバイスとその製造方法
摘要 Surface-mountable conductive polymer electronic devices include at least one conductive polymer active layer laminated between upper and lower electrodes. Upper and lower insulation layers, respectively, sandwich the upper and lower electrodes. First and second planar conductive terminals are formed on the lower insulation layer. First and second cross-conductors are provided by plated through-hole vias, whereby the cross-conductors connect each of the electrodes to one of the terminals. Certain embodiments include two or more active layers, arranged in a vertically-stacked configuration and electrically connected by the cross-conductors and electrodes in parallel. Several embodiments include at least one cross-conductor having a chamfered or beveled entry hole through the upper insulation layer to provide enhanced adhesion between the cross-conductor and the insulation layer. Several methods for manufacturing the present surface-mountable conductive polymer electronic devices are also provided.
申请公布号 JP5647305(B2) 申请公布日期 2014.12.24
申请号 JP20130154774 申请日期 2013.07.25
申请人 ブアンズ・インコーポレイテッドBOURNS,INCORPORATED 发明人 ゴードン・エル・ブアンズ;ステラー・チュー;ダニエル・イー・グリンデル;デーヴィッド・ファン;ジョン・ケリー;エリック・マイヤー
分类号 H01C7/02;H01G4/18;H01G4/252;H01G13/00 主分类号 H01C7/02
代理机构 代理人
主权项
地址