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发明名称
金属−セラミックス接合回路基板の製造方法
摘要
申请公布号
JP5643959(B2)
申请公布日期
2014.12.24
申请号
JP20110116526
申请日期
2011.05.25
申请人
发明人
分类号
H05K3/06;B23K1/00;B23K1/018;B23K1/19;C04B37/02;H05K1/03;H05K3/24
主分类号
H05K3/06
代理机构
代理人
主权项
地址
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