Method of manufacturing light emitting device including light emitting element and wavelength converting member

摘要

A method of manufacturing a light emitting device includes preparing a light emitting element and a wavelength converting member. The method further includes bonding the light emitting element and the wavelength converting member to each other by surface activated bonding. The light emitting element includes a semiconductor stacked layer portion formed on a substrate. The wavelength converting member includes a support member selected from the group of aluminum oxide, aluminum nitride, YAG without activator, and yttrium oxide. The wavelength converting member further includes a fluorescent material contained in the support member. Bonding the light emitting element and the wavelength converting member entails bonding the substrate and the support member to each other.

主权项

1. A method of manufacturing a light emitting device comprising:
preparing a light emitting element; preparing a wavelength converting member; and bonding the light emitting element and the wavelength converting member to each other using a surface activated bonding technique, wherein the light emitting element comprises a semiconductor stacked layer portion formed on a substrate, wherein the wavelength converting member comprises:
a support member comprising one selected from the group of aluminum oxide, aluminum nitride, YAG without an activator, and yttrium oxide, anda fluorescent material contained in the support member, and wherein bonding the light emitting element and the wavelength converting member comprises bonding the substrate and the support member to each other.