Electric power conversion apparatus

摘要

An electric power conversion apparatus includes a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that has an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module includes first and second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further includes a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.

主权项

1. A power converter, comprising:
a semiconductor module that comprises a power semiconductor element to convert DC power to AC power; a capacitor for smoothing the DC power; a DC-side connecting conductor that transmits the DC power from the capacitor to the semiconductor module; a passage forming body that is constructed of a thermally conductive member and forms a passage through which coolant flows; and a case that defines a housing space for housing the semiconductor module and is provided with an opening portion, wherein: the semiconductor module is disposed at one side of the passage forming body and the capacitor is disposed at another side of the passage forming body, opposite to the semiconductor module via the passage forming body; the passage forming body is provided with an opening that communicates with the passage at the side of the passage forming body where the semiconductor module is disposed and a through hole that connects between a space in which the semiconductor module is disposed and a space in which the capacitor is disposed; the semiconductor module is provided with a heat transfer plate on which the power semiconductor element is mounted via an insulating substrate; the heat transfer plate closes the opening so as to directly contact with the coolant; the opening portion of the case is closed by the passage forming body in a state in which the semiconductor module is housed in the housing space of the case; and the DC-side connecting conductor extends through the through hole to electrically connect the capacitor with the semiconductor module.