FLUORESCENCE LAYER MANUFACTURING METHOD AND LED PACKAGE MANUFACTURING METHOD USING CURABLE RESIN

摘要

A method for making a fluorescent layer using a curable resin according to the present invention comprises the steps of: forming at least one dented groove having a shape corresponding to a fluorescent layer, which is to be mounted on a light emitting diode chip, on a wafer mold; exposing the wafer mold to a fluorescent material which is a mixture of the curable resin and a florescent substance; curing the fluorescent material disposed in the dented groove; and releasing the fluorescent material disposed from the dented groove using an adhesive sheet. A method for manufacturing a light emitting diode according to the present inventions comprises the step of: mounting a light emitting diode on a substrate; forming at least one dented groove having a shape corresponding to a fluorescent layer, which is to be mounted on a light emitting diode chip, on a wafer mold; exposing the wafer mold to a fluorescent material which is a mixture of a curable resin and a florescent substance; curing the fluorescent material disposed in the dented groove; releasing the fluorescent material disposed from the dented groove using an adhesive sheet; and forming the fluorescent layer by mounting the released fluorescent material on the light emitting diode chip.