| 摘要 |
PROBLEM TO BE SOLVED: To provide a sensor capable of facilitating assembly work and improving production efficiency.SOLUTION: A terminal 5 formed on a casing 3 is connected to a strain gauge 220 of a sensor module 2 formed on a projection part 12B of a joint 1 by a conductive member 10, a cap-shaped synthetic resin base 4 forming an aperture 41A through which the strain gauge 220 is exposed on its top is formed on the projection part 12B of the joint 1, an electronic packaging product 8 is arranged on a side face part 42B intersecting with the top part 41 on which the aperture 41A of the synthetic resin base 4 is formed, and an inner peripheral surface of the synthetic resin base 4 is made slidable on an outer peripheral surface of the projection part 12B. The conductive member 10 includes a flexible substrate 6 of which one end is connected to the terminal 5 and the other end is connected to the synthetic resin base 4 and a three-dimensional circuit part 9 which is three-dimensionally formed continuously to the top part 41 of the synthetic resin base 4 and the side face part 42B, of which one end is connected to the flexible substrate 6 and to which the electronic packaging product 8 is connected. |
