PROBE CARD AND METHOD FOR MANUFACTURING THE SAME

摘要

A probe card for an electric test of a device under test on a working table incorporating a heat source includes a circuit base plate including conductive paths connected to a tester, a probe base plate including conductive paths corresponding to the conductive paths and provided with probes connected to the conductive paths, and a heat expansion adjusting member bonded to the probe base plate, having a different linear expansion coefficient from that of the probe base plate to restrain heat expansion of the probe base plate, and constituting a composite body with the probe base plate. In a case where, when the device under test is at two measuring temperatures, the composite body is at corresponding achieving temperatures, expansion changing amounts of the device under test and the composite body under temperature differences between the respective measuring temperatures and the corresponding achieving temperatures are set to be approximately equal.

主权项

1. A probe card connecting electrodes to a tester for an electric test of a device under test arranged on a working table incorporating a heat source for heating or cooling the device under test having the electrodes, the probe card comprising:
a circuit base plate arranged over the working table with a first surface thereof opposed to the working table and provided with conductive paths connected to the tester; a probe base plate held to the circuit base plate with a first surface thereof opposed to the first surface of the circuit base plate and provided with conductive paths corresponding to the conductive paths; a plurality of probes provided on a second surface of the probe base plate, connected to the corresponding conductive paths of the probe base plate, and enabling to contact the respective corresponding electrodes of the device under test on the working table; and a heat expansion adjusting member bonded to the probe base plate, having a different linear expansion coefficient from a linear expansion coefficient of the probe base plate so as to restrain heat expansion of the probe base plate, and constituting a composite body with the probe base plate, wherein, in a case where, when the device under test is at two measuring temperatures (T1, T′1), the composite body is at corresponding achieving temperatures (T2, T′2), expansion changing amounts of the device under test and the composite body under temperature differences (T1−T2, T′1−T′2) between the respective measuring temperatures and the corresponding achieving temperatures are set to be approximately equal.