发明名称 PHOSPHORUS-ATOM-CONTAINING OLIGOMER COMPOSITION, CURABLE RESIN COMPOSITION, SUBSTANCE RESULTING FROM CURING SAME, AND PRINTED CIRCUIT BOARD
摘要 <p>Solubility in organic solvents is dramatically improved while achieving excellent flame retardancy and heat resistance as a cured product. A phosphorus-atom-containing oligomer is used as a curing agent for epoxy resin, the phosphorus-atom-containing oligomer being a mixture of a phosphorus-atom-containing compound represented by structural formula (1) below with n representing 0 and a phosphorus-atom-containing oligomer represented by structural formula (1) below with n representing 1 or more: (where R 1 to R 5 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or the like; X represents a hydrogen atom or a structural unit represented by structural formula (x1) below: where, in structural formula (x1) , R 2 to R 5 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or the like), wherein a content of the phosphorus-atom-containing oligomer represented by general structural formula (1) with n representing 1 or more is in the range of 5 to 90% on a peak area basis in GPC measurement.</p>
申请公布号 EP2682398(A4) 申请公布日期 2014.12.17
申请号 EP20120757967 申请日期 2012.03.13
申请人 DIC CORPORATION 发明人 HAYASHI KOJI;SATOU YUTAKA;NAKAMURA TAKAMITSU
分类号 C07F9/6574;C07F9/6571;C08G59/32;C08G59/40;C08J5/24;C08L63/04;C09D5/18;H05K1/02;H05K1/03;H05K3/46 主分类号 C07F9/6574
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