发明名称 回路層転写により多層構造体を製作する方法
摘要 <p>A method of producing a composite structure comprises a step of producing a first layer of microcomponents on one face of a first substrate, the first substrate being held flush against a holding surface of a first support during production of the microcomponents, and a step of bonding the face of the first substrate comprising the layer of microcomponents onto a second substrate. During the bonding step, the first substrate is held flush against a second support, the holding surface of which has a flatness that is less than or equal to that of the first support used during production of the first layer of microcomponents.</p>
申请公布号 JP5640272(B2) 申请公布日期 2014.12.17
申请号 JP20110553398 申请日期 2010.03.04
申请人 发明人
分类号 H01L21/02 主分类号 H01L21/02
代理机构 代理人
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