发明名称 Non-volatile memory device and method for fabricating the same
摘要 A method for fabricating a non-volatile memory device includes forming a stacked structure where a plurality of inter-layer dielectric layers and a plurality of second sacrificial layers are alternately stacked over a substrate, forming a channel layer that is coupled with a portion of the substrate by penetrating through the stacked structure, forming a slit that penetrates through the second sacrificial layers by selectively etching the stacked structure, removing the second sacrificial layers that are exposed through the slit, forming an epitaxial layer over the channel layer exposed as a result of the removal of the second sacrificial layers, and forming a gate electrode layer filling a space from which the second sacrificial layers are removed, and a memory layer interposed between the gate electrode layer and the epitaxial layer.
申请公布号 US8912053(B2) 申请公布日期 2014.12.16
申请号 US201213607050 申请日期 2012.09.07
申请人 SK Hynix Inc. 发明人 Yoo Hyun-Seung
分类号 H01L21/332;H01L21/00;H01L21/84;H01L21/337;H01L21/336 主分类号 H01L21/332
代理机构 IP & T Group LLP 代理人 IP & T Group LLP
主权项 1. A method for fabricating a non-volatile memory device comprising: forming a stacked structure where a plurality of inter-layer dielectric layers and a plurality of second sacrificial layers are alternately stacked over a substrate; forming a channel layer that is coupled with a portion of the substrate by penetrating through the stacked structure; removing the second sacrificial layers; forming an epitaxial layer over the channel layer exposed by the removal of the second sacrificial layers; and forming a gate electrode layer filling a space from which the second sacrificial layers are removed, and a memory layer interposed between the gate electrode layer and the epitaxial layer.
地址 Gyeonggi-do KR