| 摘要 |
PROBLEM TO BE SOLVED: To provide a jointing material which prevents formation of aggregate on the surface of a copper substrate immediately after coating or after the lapse of a specified time from coating even when a dispersant is added and also prevents deterioration of the jointing power due to occurrence of cracks in a pre-dried film and a method of jointing electronic parts by using the jointing material.SOLUTION: A method of jointing an electronic part comprises applying, onto a copper substrate 10, a jointing material which consists of a silver paste comprising silver fine particles, a solvent, 2-butoxyethoxyacetic acid(BEA) as a dispersant and benzotriazole(BTA) as a reaction inhibitor, arranging an electronic part 14 on the jointing material, heating the electronic part 14, while applying a pressure, to sinter the silver in the silver paste so as to form a silver joint layer 12 and jointing the electronic part 14 to the copper substrate 10 through the silver joint layer 12. |
