METHOD AND DEVICE FOR SYMMETRICAL CHAMFERING OF SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a method and a device capable of chamfering the edges of a substrate always in a symmetrical state in accordance with the variation of a chamfering environment actively even if there is no hardware operation.SOLUTION: Provided is a method for the symmetrical chamfering of a substrate at least repeating a cycle including a step of chamfering the edges of a substrate using chamfering wheel; a step of measuring the non-symmetric chamfering deviation (x) of the chamfered edges of the substrate; and a step of controlling the relative position of the chamfering wheel to the substrate by the size of f(x) (where, f(x) denotes a function with x as a variable).