| 发明名称 |
APPARATUS FOR SEPARATING WAFER FROM CARRIER |
| 摘要 |
An apparatus for separating a wafer from a carrier includes a platform having an upper surface, a tape feeding unit, a first robot arm, and a controller coupled to the platform. The controller is configured to mount a wafer frame, by using the tape feeding unit, on a wafer of a wafer assembly on the upper surface of the platform. The wafer assembly includes the wafer, a carrier, and a layer of wax between the wafer and the carrier. The controller is also configured to heat the upper surface of the platform to a predetermined temperature and separate, by the first robot arm, the wafer and the wafer frame mounted thereon from the carrier. |
| 申请公布号 |
US2014360671(A1) |
申请公布日期 |
2014.12.11 |
| 申请号 |
US201414465185 |
申请日期 |
2014.08.21 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
HWANG Chien Ling;WANG Lin-Wei;LIU Chung-Shi |
| 分类号 |
H01L21/683;B32B41/00;B32B38/18;B32B37/06;H01L21/68;B32B38/10;B32B39/00;B32B43/00;H01L21/687;B32B37/00;B32B37/16 |
主分类号 |
H01L21/683 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An apparatus, comprising:
a platform having an upper surface; a tape feeding unit; a first robot arm; and a controller coupled to the platform, the tape feeding unit, and the first robot arm, the controller being configured to:
mount a wafer frame, by using the tape feeding unit, on a wafer of a wafer assembly on the upper surface of the platform, the wafer assembly including the wafer, a carrier, and a layer of wax between the wafer and the carrier; heat the upper surface of the platform to a predetermined temperature; and separate, by the first robot arm, the wafer and the wafer frame mounted thereon from the carrier. |
| 地址 |
Hsinchu TW |
