| 摘要 |
An objective of the present invention is to improve a reliability of a semiconductor device. A semiconductor device (PKG) includes an insulating base material (BS) having a through hole (SH), a terminal (TE) formed on a lower surface (BSb) of the base material (BS), and a semiconductor chip (CP) mounted on an upper surface (BSa) of the base material in a face-up manner. In addition, the semiconductor device has a conductive member such as a wire (BW), which electrically connects a pad (PD) of the semiconductor chip (CP) with an exposed surface (EX) of the terminal (TE) which is exposed through the through hole (SH) of the base material (BS), and has a sealing body (MR) for sealing the conductive member, an inside of the through hole (SH) of the base material (BS), and the semiconductor chip(CP). In the exposed surface (EX) of the terminal (TE) which is exposed through the through hole (SH) of the base material (BS), an anchor unit is provided at a region other than a bonding part to which the conductive member such as the wire (BW) is bonded. |
