| 摘要 |
The present invention relates to an ultrasonic transducer with a dual mode for wire bonding and a bonding apparatus with the dual mode for wire bonding including the same. According to the present invention, a front part into which a capillary is inserted is formed on the front side of a body part. A rear part is formed on the rear side of the body part and protrudes to be symmetrical with regard to the front part. A fixing part is formed on both sides of the body part. Also, a control groove is formed on the rear part of the body part to control impedance. Thereby, the ultrasonic transducer according to the present invention is used for ball bonding and wedge bonding by including two target frequencies at the same time and performs bonding with high quality for a short time by including low impedance. |
