| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a material such as a flexible substrate, having both of flexibility and strong toughness at a high level without spoiling fundamental properties of a solder resist or the like, such as heat resistance durable to heat generated in a substrate production process such as soldering or from an element, retentivity of high insulating property for a long period of time, and durability to a chemical treatment such as a plating treatment while enabling photopatterning. <P>SOLUTION: An epoxycarboxylate compound is obtained by reacting an epoxy compound having two epoxy groups in one molecule with a compound having both of at least one polymerizable ethylenically unsaturated group and one carboxyl group in the molecule. A polyurethane compound is obtained by reacting the epoxycarboxylate compound, a compound having both of two hydroxyl groups and at least one carboxyl group in one molecule, a specified polyester diol compound, and a diisocyanate compound. An active energy ray-curable resin composition contains the polyurethane compound and has the conflicting performances at a high level. <P>COPYRIGHT: (C)2011,JPO&INPIT |
