发明名称 Integrated molded product
摘要 Provided is an integrated molded product in which a molded resin product containing a phosphorus compound is used and an addition-reactive silicone adhesive agent is used to achieve strong bonding. The integrated molded product comprises a thermoplastic resin molded product made of a thermoplastic resin composition comprising a polybutylene terephthalate resin and a phosphorus compound, the content of the phosphorus compound being 0.5% by mass or less; an addition-reactive silicone composition; and a member; and the thermoplastic resin molded product and the addition-reactive silicone composition are brought into contact with each other. The phosphorus compound to be used is preferably a trivalent phosphorous compound.
申请公布号 US8906988(B2) 申请公布日期 2014.12.09
申请号 US201113880996 申请日期 2011.10.28
申请人 Wintech Polymer Ltd. 发明人 Doi Kumiko;Sakata Kouichi
分类号 C08K5/49;C08K5/51;C08K5/524;C08K5/5393;B32B27/36;C08L67/02;C08J5/12;C08K5/527 主分类号 C08K5/49
代理机构 Hoffmann & Baron, LLP 代理人 Hoffmann & Baron, LLP
主权项 1. An integrated molded product comprising a thermoplastic resin molded product made of a thermoplastic resin composition consisting of a polybutylene terephthalate resin, a phosphorus compound, and at least one component selected from an inorganic filler, an anti-oxidant, and a pigment, the content of the phosphorus compound being 0.5% by mass or less and the content of the polybutylene terephthalate resin being 40% by mass to 69.9% by mass; an addition-reactive silicone composition; and a member; wherein the thermoplastic resin molded product and the addition-reactive silicone-based composition are in contact with each other, and the phosphorus compound is a trivalent phosphorus compound.
地址 Tokyo JP