Multichip electronic packages and methods of manufacture

摘要

A multi-chip electronic package and methods of manufacture are provided. The structure includes a lid encapsulating at least one chip mounted on a chip carrier; at least one seal shim fixed between the lid and the chip carrier, the at least one seal shim forming a gap between pistons of the lid and respective ones of the chips; and thermal interface material within the gap and contacting the pistons of the lid and respective ones of the chips.

主权项

1. A structure comprising:
a lid encapsulating at least one chip mounted on a chip carrier; at least one seal shim fixed between the lid and the chip carrier by use of a sealant, the at least one seal shim and the sealant forming a uniform gap amongst the pistons of the lid and corresponding ones of the chips regardless of chip height and tilt variation; thermal interface material within the uniform gaps and contacting the pistons of the lid and respective ones of the chips; and machined protrusions extending from the lid which are structured to align the at least one seal shim with the lid by extending into one or more holes of the seal shim in order to make appropriate alignment of the seal shim, wherein the at least one seal shim includes holes and the machined protrusions are insertable into the holes of the seal shim and the at least one seal shim has a thickness that results in the uniform gap between the pistons with the corresponding ones of the chips on the chip carrier.