| 发明名称 |
ADHESIVE COMPOSITION, ADHESIVE FILM, AND BONDING METHOD |
| 摘要 |
<p>The adhesive composition according to the present invention contains a block copolymer, and an adhesive layer formed by using the adhesive composition has a Young's modulus of 0.1 GPa or greater at 23°C, a storage modulus (G') of 1.5 × 10 5 Pa or less at 220°C, and a loss factor (tan Ã) of 1.3 or less at 220°C.</p> |
| 申请公布号 |
KR20140140124(A) |
申请公布日期 |
2014.12.08 |
| 申请号 |
KR20147031079 |
申请日期 |
2013.03.14 |
| 申请人 |
TOKYO OHKA KOGYO CO., LTD. |
发明人 |
TAMURA KOKI;IMAI HIROFUMI;OGATA TOSHIYUKI;KUBO ATSUSHI;YOSHIOKA TAKAHIRO |
| 分类号 |
C09J153/00;C09J5/00;C09J7/02;C09J153/02;H01L21/304 |
主分类号 |
C09J153/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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