An LED unit (100) is provided with a base unit (1). The LED unit is further provided with a mounting substrate (3b) and a light-emitting unit (3a) provided on the mounting substrate and having an LED chip, and the LED unit is further provided with a light-emitting device (3) disposed on the surface of the base unit. The base unit comprises a compact in which a metal member (11) is covered with a thermally conductive resin having electrical insulating properties, the thermally conductive resin being interposed between the light-emitting device and the metal member. Heat generated by the light-emitting device can thus be efficiently dissipated through the base unit to an appliance to which the LED unit is attached.
