发明名称 |
APPARATUS AND METHOD FOR STRIPPING SOLDER METALS DURING THE RECYCLING OF WASTE ELECTRICAL AND ELECTRONIC EQUIPMENT |
摘要 |
Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module. |
申请公布号 |
KR20140139131(A) |
申请公布日期 |
2014.12.04 |
申请号 |
KR20147031333 |
申请日期 |
2012.12.13 |
申请人 |
ADVANCED TECHNOLOGY MATERIALS INC. |
发明人 |
CHEN TIANNIU;KORZENSKI MICHAEL B.;JIANG PING |
分类号 |
B09B5/00;B09B3/00;B29B17/02;H05K3/34 |
主分类号 |
B09B5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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