| 摘要 |
The invention relates to a chip assembly (18) having a connection substrate (12) and a plurality of semiconductor substrates (1) arranged on the connection substrate, in particular chips, wherein connection surfaces (5) arranged on a contact surface of the chips (1) are connected to connection surfaces on a contact surface (14) of the connection substrate (12), wherein a side edge of the chips (1) extends parallel to the contact surface of the connection substrate (12), and the contact surface of the chips (1) extends transversely to the contact surface of the connection substrate (12), through-connections (13) arranged in the connection substrate connect outside contacts (15) arranged on an outside contact side to the contact surfaces designed as inside contacts (14) on the contact surface of the connection substrate, and connection surfaces of the chips (1) adjacent to the side edge are connected to the inside contacts of the connection substrate via a remelted solder material depot (16). The invention further relates to a method for manufacturing a chip assembly (18). |
