| 发明名称 |
PIEZOELECTRIC DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME |
| 摘要 |
A piezoelectric device package may include: a case having a plurality of terminals formed on a lower surface thereof; a piezoelectric device formed in the case; a temperature measuring device formed on the lower surface of the case and having a thin film form; and a cover member enclosing an upper portion of the case. |
| 申请公布号 |
US2014355647(A1) |
申请公布日期 |
2014.12.04 |
| 申请号 |
US201414294910 |
申请日期 |
2014.06.03 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
Lee Soon Bum;Cha Sang Yeob;Lee Jong Pil;Yasuda Katsushi |
| 分类号 |
G01K7/32;H01L41/25 |
主分类号 |
G01K7/32 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A piezoelectric device package comprising:
a case having a plurality of terminals disposed on a lower surface thereof; a piezoelectric device disposed in the case; a temperature measuring device having thin film form and disposed on the lower surface of the case; and a cover member enclosing an upper portion of the case. |
| 地址 |
Suwon-Si KR |
