发明名称 SEMICONDUCTOR DEVICE
摘要 <p>This semiconductor device is provided with a first semiconductor chip, a second semiconductor chip, and a main electrode which is electrically connected to the first semiconductor chip and the second semiconductor chip. The main electrode is provided with a first electrode section having one end that is electrically connected to the first semiconductor chip, a second electrode section having one end that is electrically connected to the second semiconductor chip, a connection section that connects the other end of the first electrode section and the other end of the second electrode section, a body section connected to the connection section, and an external connection section connected to a portion of the body section on the first electrode section side. The inductance of a current path from the one end of the first electrode section to the external connection section is larger than the inductance of a current path from the one end of the second electrode section to the external connection section when the effect of a magnetic field from the body section is eliminated.</p>
申请公布号 WO2014192118(A1) 申请公布日期 2014.12.04
申请号 WO2013JP65064 申请日期 2013.05.30
申请人 MITSUBISHI ELECTRIC CORPORATION 发明人 SAKAI, YASUHIRO;KITAMURA, SHUICHI
分类号 H01L25/07;H01L25/18;H02M7/48 主分类号 H01L25/07
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