发明名称 COOLED LASER DIODE MODULE
摘要 The present invention relates to a cooled laser diode module. A cooled laser diode module according to an embodiment of the present invention includes a laser diode for outputting an optical signal and provided with a plurality of pins; a block member having a box shape and a hollow fitted with the laser diode; a laser diode fixing ring for coupling the laser diode into the hollow of the block member; an L-shaped heatsink formed with a hole corresponding to the hollow of the block member and making contact with one side surface on which the hollow is formed and an entire low surface such that heat of the block member is discharged to an outside; and a heat dissipation foil having an area corresponding to one side surface of the block member having the hollow, wherein the heat dissipation foil has a plurality of through-holes formed at locations corresponding to a plurality of pins of the laser diode, one side surface of the heat dissipation foil makes contact with the laser diode, the laser diode fixing ring and one side surface of the block member having the hollow and the opposite side surface makes contact with a side of the heatsink having the hole, such that the heat generated from the laser diode is directly radiated to an outside and in addition, the heat transferred from the laser diode to the laser diode fixing ring and the block member is transferred to the heatsink to indirectly radiate the heat.
申请公布号 KR101468609(B1) 申请公布日期 2014.12.03
申请号 KR20130064381 申请日期 2013.06.05
申请人 LED PACK 发明人 PARK, JUN HEE;PARK, HO SAN;KIM, SEOK TAE;PARK, MIN HEE;BAE, JIN HYOUNG
分类号 H01S5/024 主分类号 H01S5/024
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