| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device which has superior productivity without a flax washing process, and can reduce warpage caused by grinding a back surface of a semiconductor wafer, and the semiconductor device manufactured by using the same. SOLUTION: A method for manufacturing a semiconductor device comprises a first step for forming a resin composition layer with a flux function and a back grind tape on a circuit surface of a semiconductor wafer where a first connecting electrode is provided thereon, in this order; a second step for grinding an opposing surface to the circuit surface of the semiconductor wafer; a third step for laminating a dicing tape on the opposing surface to the circuit surface of the semiconductor wafer; a forth step for peeling off the back grind tape; a fifth step for dividing the resin composition layer with the flux function and the semiconductor wafer into pieces to obtain a semiconductor chip having the resin composition layer with the flux function; and additional two steps. COPYRIGHT: (C)2012,JPO&INPIT |
