| 发明名称 | Board unit and method of fabricating the same | ||
| 摘要 | A board unit includes a board that has a through hole penetrating the board from a first side of the board to a second side of the board and having a conductive inner wall surface a first electronic component that has a first connection pin to be press-fitted in the through hole from the first side of the board, and a conductive member that is disposed in the through hole to connect the inner wall surface of the through hole to the first connection pin. | ||
| 申请公布号 | US8901434(B2) | 申请公布日期 | 2014.12.02 |
| 申请号 | US201213422328 | 申请日期 | 2012.03.16 |
| 申请人 | Fujitsu Limited | 发明人 | Yasuo Akihiro;Kuroda Koji |
| 分类号 | H05K1/11;H05K1/16;H05K1/00;H01R13/73;H05K3/30;H05K1/02;H05K3/42 | 主分类号 | H05K1/11 |
| 代理机构 | Staas & Halsey LLP | 代理人 | Staas & Halsey LLP |
| 主权项 | 1. A board unit comprising: a board that has a through hole penetrating the board from a first side of the board to a second side of the board and having a conductive inner wall surface; a first electronic component that has a first connection pin to be press-fitted in the through hole from the first side of the board; a conductive member that is disposed in the through hole to connect the inner wall surface of the through hole to the first connection pin; and a second electronic component that has a second connection pin to be press-fitted in the through hole from the second side of the board, the conductive member being disposed in the through hole so as to connect the first connection pin to the second connection pin. | ||
| 地址 | Kawasaki JP | ||