| 摘要 |
A substrate de-bowing mechanism, system and method are described. The mechanism can include a substrate support, one or more stationary contact members, and one or more dynamic or movable contact members that are adapted to contact the substrate and bend the substrate in a desired direction to reduce or eliminate bowing of the substrate. The mechanism is controlled by a CPU or other controller that can adjust the de-bow parameters of the de-bowing mechanism based on input settings that can be dynamic and/or static settings. The mechanism can be used to de-bow a variety of substrates including plastic cards, passports, and passport pages. |
| 主权项 |
1. A substrate de-bowing mechanism, comprising:
a substrate support having a substrate travel path; a first, stationary substrate contact member mounted on the substrate support and positioned to engage a surface of a substrate during de-bowing; and a first, movable substrate contact member rotatably mounted on the substrate support for rotation about a rotation axis, and the first, movable substrate contact member is rotatable between a first home position that is on one side of the substrate travel path to permit engagement of the first, movable substrate contact member with a first surface of the substrate and a second home position that is on a second, opposite side of the substrate travel path to permit engagement of the first, movable substrate contact member with a second surface of the substrate. |
