| 摘要 |
An electroless plating solution (30) containing a metal that serves as a plating material and a reducing agent is placed in a plating bath (2); a reference electrode (5) and a counter electrode (6) are so arranged as to be in contact with the electroless plating solution in the plating bath; and an electrically conductive part of an object to be plated is brought into contact with the electroless plating solution in the plating bath without a catalyst being interposed therebetween. While keeping this state, the potential of the electrically conductive part of the object to be plated, which is determined relative to the potential of the reference electrode, is kept at a potential that is equal to or lower than a potential at which the plating material can be deposited on the electrically conductive part of the object to be plated. In this manner, the plating material can be deposited without causing the adhesion of the catalyst onto the electrically conductive part of the object to be plated. |
