发明名称 SENSOR MODULE AND PACKET RELAY APPARATUS WITH DAISY CHAIN
摘要 <p>The present invention relates to a semiconductor sensor module and a packet transmission device based on a daisy chain connection, wherein the packet transmission device enables each sensor module, which receives data from a sensor used in a semiconductor manufacturing process, to be connected in a daisy chain and transmits an Ethernet packet from one side to the other side. The semiconductor sensor module comprises: a sensor interface part that is connected to various sensors used in a semiconductor manufacturing process and receives sensor data collected by the sensors; a network relay part that relays an Ethernet packet, which is inputted from the outside through a daisy chain connection, to the other side; and an Ethernet packet generation part that generates an Ethernet packet to transmit the sensor data to the outside.</p>
申请公布号 KR101465499(B1) 申请公布日期 2014.11.26
申请号 KR20130095760 申请日期 2013.08.13
申请人 SYSWIN ELECTRONICS CO., LTD. 发明人 KIM, YONG BUM;YOO, WAN OK
分类号 H04L29/02;H04L12/70 主分类号 H04L29/02
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