パワーモジュール基板及び当該基板の製造方法,申请号JP20110279542-传众专利搜索

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发明名称	パワーモジュール基板及び当該基板の製造方法
摘要
申请公布号	JP5631857(B2)	申请公布日期	2014.11.26
申请号	JP20110279542	申请日期	2011.12.21
申请人		发明人
分类号	H01L23/36;H01L23/12	主分类号	H01L23/36
代理机构		代理人
主权项
地址

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