发明名称 SET FOR ADJUSTING WATER-BASED DISPERSING ELEMENT FOR CHEMICAL-MECHANICAL POLISHING
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a set for adjusting a water-based dispersing element for chemical-mechanical polishing which can suppress surface defects such as dishing, erosion, and scratches in a process of flattening a polished surface by chemical-mechanical polishing, and which excels in long-time stability even in a concentrated state. <P>SOLUTION: The set for adjusting the water-based dispersing element for chemical-mechanical polishing is composed of a water-based dispersing element (A) which is blended with a dispersing agent in accordance with an abrasive grain and a need, and an aqueous solution (B) which is blended with an organic acid in accordance with the abrasive grain and the need. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005158867(A) 申请公布日期 2005.06.16
申请号 JP20030392309 申请日期 2003.11.21
申请人 JSR CORP 发明人 UCHIKURA KAZUICHI;NISHIMOTO KAZUO;HATTORI MASAYUKI;KAWAHASHI NOBUO
分类号 B24B37/00;H01L21/304;(IPC1-7):H01L21/304 主分类号 B24B37/00
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