| 摘要 |
<p>A light-emitting device (100) includes: a substrate (1); the metal film (30) at the mounting region (1a) on the substrate (1); a light-emitting part (20) including a plurality of light-emitting elements (2) disposed on the metal film (30); metal members (40) formed on the substrate (1), respectively including pad parts(3a, 4a) and wiring parts (3b, 4b), forming a positive electrode (3) and a negative electrode (4) configured to apply a voltage to the light-emitting element (2) through the wiring parts (3b, 4b), respectively; and a plating wire connected to the metal film (30), extended to a side face of the substrate (1). The metal film (30) and the metal members (40) are independently disposed. The wiring part (3b) of the positive electrode (3) and the wiring part (4b) of the negative electrode (4) are formed at a circumference of the mounting region (1a). The metal members (40) are formed apart from the circumferential edge of the substrate (1) on the side of the mounting region (1a) of the substrate (1).</p> |
