Device and method for detaching a semiconductor wafer from a substrate

摘要

Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate.;Furthermore, the invention relates to a method for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, and a stripping of the product substrate from the carrier substrate from the periphery of the product substrate being caused by the stripping means.

主权项

1. Device for stripping, in combination with a product substrate and a carrier substrate, the carrier substrate connected to the product substrate by an interconnect layer, wherein the device for stripping separates the product substrate from the carrier substrate, the device comprising:
a flexible film having an upper surface and a lower surface, the flexible film including:
a bonding surface section on the lower surface,an adhesive layer on the bonding surface section, the adhesive layer for holding the product substrate on the bonding surface section of the flexible film,an attachment section on the lower surface of the film wherein the attachment section surrounds the outer periphery of the bonding surface section, anda stripping section of the flexible film located between the bonding surface section and the attachment section; a film frame mounted to the flexible film, the film frame mounted to the lower surface of the flexible film at the attachment section; a stripping means for stripping the product substrate from the carrier substrate from at least a periphery of the product substrate; and a connection release means comprising a fluid, wherein the connection release means is disposed only around an outer periphery of the product substrate.