| 摘要 |
<p>Provided is a copper film-forming composition, which is in the form of a solution and can obtain a copper film having sufficient electrical conductivity when heated at a relatively low temperature. This copper film-forming composition contains 0.01 to 3.0 mol/kg of copper formate or its hydrate, 0.01 to 3.0 mol/kg of copper acetate or its hydrate, at least one diol compound selected from a group of diols of formula (1) and diols of formula (1'), a piperidine compound of formula (2), and an organic solvent. When a content of the copper formate or its hydrate is assumed to be 1 mol/kg, the diol compound is contained in a range of 0.1 to 6.0 mol/kg and the piperidine compound is contained in a range of 0.1 to 6.0 mol/kg.</p> |
