发明名称 CIRCUIT BOARD ASSEMBLY
摘要 PROBLEM TO BE SOLVED: To provide a circuit board assembly that allows preventing a soldering defect when an electronic component is inclined to a circuit board.SOLUTION: A circuit board assembly 10 includes: a capacitor 14 having a positive-side main electrode 22 (negative-side main electrode 24) and an auxiliary electrode 32 (auxiliary electrode 34) disposed adjacent to the positive-side main electrode 22 (negative-side main electrode 24); and a circuit board 12 having a first land 38A (third land 38C) to which the positive-side main electrode 22 (negative-side main electrode 24) is bonded by soldering, and a second land 38B (fourth land 38D) to which the auxiliary electrode 32 (auxiliary electrode 34) is bonded by soldering and disposed spaced apart from the first land 38A (third land 38C).
申请公布号 JP2014220480(A) 申请公布日期 2014.11.20
申请号 JP20130211316 申请日期 2013.10.08
申请人 ASMO CO LTD 发明人 SUMI TOMOAKI
分类号 H05K1/18;H01G2/06;H05K3/34 主分类号 H05K1/18
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