PRINTED WIRING BOARD MATERIAL AND PRINTED WIRING BOARD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a printed wiring board material exhibiting high breaking elongation properties and excellent in fire retardancy and to provide a printed wiring board using the same.SOLUTION: The printed wiring board material includes: an epoxy compound; a phenol compound as a curing agent of the epoxy compound; and a cellulose nanofiber of 3 nm to 1000 nm in number-average fiber diameter. The printed wiring board material may be suitably used for a solder resist layer 12, a core substrate 2, and interlayer insulation layers 6 and 9. The printed wiring board material is used for a printed wiring board.