| 摘要 |
<p>A segment type diamond tool has diamond particles appropriately distributed on segments of the diamond tool, thereby providing an excellent cutting rate and reducing fine debris generated during a cutting operation. The diamond tool comprises a plurality of segments, each of the segments having a single plate-shaped layer or a plurality of plate-shaped layers of diamond particles arranged thereon, and the layers of diamond particles being arranged on the segment such that cutting grooves formed on a workpiece by a trailing layer of diamond particles are arranged between cutting grooves formed thereon by a leading layer of diamond particles, respectively, during a cutting operation on the workpiece, wherein the diamond particles are arranged at a predetermined tilt angle to a line connecting upper vertices or a line connecting lower vertices of a cross section, cut parallel in a cutting direction and perpendicular to a cutting surface, so that the diamond particles are protruded and uniformly spaced from each other on the cutting surface of the segment during the cutting operation on the workpiece.</p> |
