| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable imaging device 1A having a small diameter.SOLUTION: An imaging device 1A includes an imaging element chip 10A in which an imaging section 13, a circuit part 14 having a plurality of layers including an insulation layer 12C composed of a low dielectric constant material having a dielectric constant lower than that of silicon oxide, an electrode pad 15, and a guard ring 16 composed of one or more materials selected from materials having a moisture resistance better than that of the low dielectric constant material are formed on the first principal surface 10SA, a cover glass 30 bonded to the first principal surface 10SA of the imaging element chip 10A via an adhesive layer 20 and having the plan view dimensions same as those of the imaging element chip 10A, and a post ring 31 disposed between the guard ring 16 and the cover glass 30, composed of a material having a moisture resistance better than that of the adhesive layer 20 and dividing the adhesive layer 20. |
