发明名称 WIRING BOARD AND ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a wiring board which reduces the possibility that a conductor layer is peeled from an insulation base material.SOLUTION: A wiring board 1 of the invention includes: an insulation base material 11; a heat radiation member 12 is provided in the insulation base material 11 and contains Cu; a conductor layer 13 which is provided in the insulation base material 11, has a connection part 13a connected with the heat radiation member 12 and an exposed part 13b partially exposed from the insulation base material 11, and contains Cu; and an auxiliary metal layer 14 which is provided in the insulation base material 11, contacts with a portion located between the connection part 13a of the conductive layer 13 and the exposed part 13b, and contains Cu.
申请公布号 JP2014216547(A) 申请公布日期 2014.11.17
申请号 JP20130094033 申请日期 2013.04.26
申请人 KYOCERA CORP 发明人 KAWAGOE HIROSHI;SUDA IKUNORI;MORIYAMA YOSUKE
分类号 H05K3/46;H01L23/12 主分类号 H05K3/46
代理机构 代理人
主权项
地址