| 摘要 |
PROBLEM TO BE SOLVED: To provide a light emitting device which, with less amount of reflection members, provides a shielding effect similar to that of a conventional device containing much reflection members, with damage on a wire being prevented.SOLUTION: A semiconductor light emitting device 100 includes a sub-mount substrate 20 on which a wiring pattern is formed, with one or a plurality of light emitting elements 30 mounted, a metal substrate 10 which is equipped with an electrode part, for fixing the sub-mount substrate 20, a wire 50 for electrically connecting the wiring pattern of the sub-mount substrate 20 to the electrode part of the metal substrate 10, and a reflection part 40 which is positioned on a light emitting element mounting surface of the sub-mount substrate, and partially covers the light emitting element mounting surface of the sub-mount substrate, a side surface of the light emitting element 30, and the wire 50. Relating to the wire 50, between the junction part to the sub-mount substrate and the junction part to the metal substrate, a bending part is formed at a level higher than the position of the intersection between the reflection part 40 and the wire 50. |
