| 摘要 |
PROBLEM TO BE SOLVED: To provide a power module capable of improving heat resistance of a silicone gel packed in a case so as to be used under a high-temperature environment.SOLUTION: A power module 10 includes a one or two or more power semiconductor chips 11, a case 14 for accommodating the power semiconductor chip, and a silicone gel 18 which is packed in the case 14 and seals the power semiconductor chips. The silicone gel 18 is composed of a heat resistance silicone gel containing at least one kind of metal complex of 20 to 100 mass ppm selected from a group in which metal is made of Fe and Pt. |
