| 摘要 |
A chip on flex structure includes a capping layer which completely covers a metal bump installed on a metal pad, a bump alloy layer which is directly interposed between the metal bump and the capping layer, a cover layer which completely covers a lead layer attached to a polymer material layer, a lead alloy layer which is directly interposed between the lead layer and the cover layer, and an interface alloy layer which is directly interposed between the cover layer and the capping layer. The bump alloy layer, the lead alloy layer, and the interface alloy layer have a slop composition, respectively. |
