| 摘要 |
Provided is a chip on glass structure which includes a protection layer located on a metal pad, a bonding layer located on the metal pad or a part of the protection layer, a metal bump which is partly located in a concave part and covers the bonding layer, a capping layer which completely covers the metal bump, a lead layer which is directly connected to a glass layer, and a conductive particle layer which is electrically connected to the capping layer and the lead layer. |
